TUNGSTEN SPUTTERING TARGET

TUNGSTEN SPUTTERING TARGET, ROTATABLE SPUTTERING TARGETS, THIN FILM, FOIL, DEPOSITION MATERIAL, EVAPORATION MATERIALS, ROD, WIRE, BAR, SHEET, INGOT, PLATE


Tungsten Sputtering Deposition
Uses & Applications for Tungsten Sputtering Targets
Deposition Methods that do not Require Tungsten Sputtering Targets

Tungsten Carbide Sputtering Target
Tungsten Oxide Rotatable Sputtering Target
Tungsten Oxide Sputtering Target
Tungsten Rotatable Sputtering Target
Tungsten Silicon Sputtering Target
Tungsten Sputtering Target
Tungsten Titanium Sputtering Target


Sputtering Target, Foil, Rod, Wire, Bar, Sheet, Plate and < 0.5 mm Thin Film from rare earth and other electronic and optic materials.  American Elements produces high purity metals and compounds with the highest possible density and smallest possible average grain sizes for use in semiconductor, chemical deposition and physical vapor deposition (PVD) display and optical applications. We also produce the rare earths and most advanced metals as cast rods and plates.99.999% Gold Foil for chemical vapor deposition


Materials are produced using crystallization, solid state and other ultra high purification processes. American Elements specializes in producing custom compositions for research and new proprietary technologies.

Indium Sputtering Target

Sputtering Targets. Our standard target sizes range from 1" to 8" in diameter and from 2mm to 1/2" thick. We can also provide targets outside this range in addition to just about any size rectangular, annular, or oval target. Materials are produced using crystallization, solid state and other ultra high purification processes such as sublimation. American Elements specializes in producing custom compositions for commercial and research applications and for new proprietary technologies. American Elements also casts any of the rare earth metals and most other advanced materials into rod, bar or plate form, as well as other machined shapes and through other processes such as nanoparticles (See also application discussion at Nanotechnology Information and at Quantum Dots) and in the form of solutions and organometallics. Other shapes are available by request.

Rotatable Targets. For large area thin film deposition, American Elements produces rotatable sputtering targets by plasma deposition onto a tubular substrate and by casting. Rotatable sputtering targets are available up to 1,000 mm in length and can be produced from a number of metallic, oxide and alloy sources for use in many applications where large film areas are required, such as photovoltaic and other coatings.

All machined pieces are produced by casting oversized blanks, and machining down to required specifications. They are usually machined to tolerances of +0.010"/-0" on diameter, length or width, and +/-0.005" on thickness. Larger targets are also finished to a flatness within 0.015". We can accommodate tighter tolerances upon request.

SPUTTERING DEPOSITION

Sputtering deposition uses a plasma, which is usually formed from a non-reactive gas, to bombard the target material for the thin film and knock the atoms of the target material out of its bulk. The ejected atoms then land on the substrate and form a thin film.  Since the target does not need to be heated, the technique is very flexible for a wide range of applications.  The targets can even be made of compounds or mixtures, not just pure elements.

USES & APPLICATIONS FOR SPUTTERING TARGETS

Uses & applications for sputtering targets and other evaporation materials have continued to expand. The most recent uses are described below and in the new PBS NOVA series "Making Stuff". When relevant, properties and the latest research is also covered.

Electronics and Semiconductors. The first commercial use for the sputtering target was in semiconductors and electronics for front end and back end packaging, diffusion barriers, compounds, phase change memory, IC interconnects, micro contacts, and in sensors, MEMs and LEDs. Sputtering targets and evaporation materials of copper and copper alloys including copper-nickel, copper-chromium are manufactured for packaging and other applications, as well as, nickel and many nickel alloys including nickel-aluminum, nickel-vanadium, nickel-platinum, nickel-copper and nickel-chromium. Aluminum is available In its elemental form and alloyed with copper and silicon as aluminum-copper, aluminum-silicon and aluminum-copper-silicon. Elemental titanium is available up to 99.999% purity and alloyed in titanium-tungsten. The conductive and solder wetting properties of gold make it an important deposition material, including gold alloys such as gold-tin, gold-antimony, gold-silicon, gold-copper, and gold-germanium. Recent materials include Phase Change Alloys such as germanium-antimony alloyed with tellurium, silver, indium and platinum and transparent conductive oxides (TCO) for light emitting applications such as sensors and light emitting diodes (LED). These include indium-tin oxide (ITO) and zinc oxide doped with aluminum and other elements (ZnO). American Elements also produces ultra high purity sputtering targets and other evaporation materials for electronic applications including hafnium, molybdenum, silver, iridium, rhodium and ruthenium.

Anti-abrasive coatings for Wear Protection. Electroplating of tool, die, drilling and cutting tool active surfaces to protect against wear and extend life has given way in recent years to the deposition of these coating materials as a more cost effective alternative. Typical protective materials using sputtering targets and other evaporation materials include titanium, titanium carbide, silicon carbide, boron carbide, aluminum, nickel, chromium and tungsten carbide.

Magnetic Materials. The use of high strength magnets have found application is numerous industries including automotive, aerospace, biomedical imaging and auditory engineering. sputtering targets and other evaporation materials of these advanced magnetic materials are manufactured by American Elements from samarium cobalt and neodymium iron boron alloy.

Optical and Architectural Glass. The ability of certain elements to selectively absorb and emit highly specific wave length ranges and also reduce glare due to their high refractive index when deposited on a glass substrate resulted in the development of sputtering and evaporation materials of elemental rare earths, such as neodymium and dysprosium and many other optically active and anti-reflective (AR) materials. More recently, architectural glass for residential, commercial and office building applications has benefited from the availability of these same coatings.

Photovoltaic Solar Energy Panels. The three primary solar energy technologies, silicon based, Copper Indium Selenide (CIS) and Copper Indium Gallium Selenide (CIGS) are layered structures that require sputtering targets and other evaporation materials at several stages including certain transparent conductive oxides (TCO) such as indium tin oxide (ITO) and doped zinc oxide as the top electrode, molybdenum as the back plate, and antimony telluride and zinc telluride in CIS and CIG photovoltaic cells.

Solid Oxide Fuel Cells. Typical solid oxide fuel cell (SOFC) designs contain an electronically conductive low density cathode, a high density, ionically conductive electrolyte and an electronically conductive open air electrode. New technology is being developed for the deposition of these layers. Sputtering targets are produced by American Elements to meet the needs of each of these layers including Perovskite cathode materials including Lanthanum Strontium Manganite (LSM), Lanthanum Strontium Ferrite (LSF), Lanthanum Strontium Cobaltite Ferrite (LSCF), Lanthanum Strontium Chromite (LSC), and Lanthanum Strontium Gallate Magnesite (LSGM) with doping levels and other parameters to customer specifications and ionically conductive electrolytes including YSZ (Yttria stabilized Zirconia), SCZ (Scandium doped Zirconia), Samarium doped Ceria, Gadolinium doped Ceria and Yttrium doped Ceria. These fuel cells materials are marketed under the trademark AE Fuel Cells.

Data Storage. Sputtering targets and other evaporation materials are now essential to the coating and manufacturing of optical storage devices such as CDs and DVDs to provide both wear protection and reflectivity.

DEPOSITION METHODS THAT DO NOT REQUIRE SPUTTERING TARGETS

Pulsed laser deposition (PLD) uses pulses of a high-power laser beam to ablate the target material.  The material on the target surface is instantly evaporated and turned into plasma, and it returns back to vapor phase.  Finally, the ablated material then collects and deposits on top of a correctly placed substrate.  This technique has the advatages over the others in that it preserves the stoichiometry of the target on the film formed and the rate of deposition is higher than the others.

Physical vapor deposition (PVD). PVD refers to the purely physical formation of the thin film on top of the substrate,  there should be no chemical reactionUltra High Purity Cadmium Telluride Bouleinvolved in the formation of the thin film.  Typically PVD is done in a low-pressure environment, though there are a number of PVD techniques. Evaporation deposition raises the temperature of material of thin film so its vapor pressure reaches a useful range.  The vapor then moves and deposits on top of the substrate of interest. Electron Beam Evaporation a form of PVD in which the target anode is bombarded with an electron beam given off by a charged tungsten filament under high vacuum. The electrion beam causes atoms from the target material to transform into a gaseous phase, these atoms then return to solid form coating everything in the vacuum chamber with a thin film. It can also be used in conjuction with molecular beam epitaxy (MBE).

Electron beam evaporation research applications include medical, metallurgical, telecommunication, microelectronics, optical coating, nanotechnology and semiconductor industries. Typical source materials include titanium, platinum, aluminum, aluminum oxide, antimony, barium, bismuth, boron, boron carbide, calcium, cerium, chromium, chromium oxide, cobalt, dysprosium, erbium, gadolinium, hafnium, hafnium oxide, indium, indium tin oxide, iridium, iron, lead, lithium, lithium fluoride, magnesium, magnesium fluroide, magnesium oxide, manganese, molybdenum, neodymium, nickel, nickel-chromium, nickel iron, niobium, palladium, permalloy hymu 80 (Fe-Mn-Mo-Ni), rhenium, rhodium, ruthenium, samarium, scandium, selenium, silicon, silicon dioxide, silicon monoxide, strontium, tantalum, tantalum oxide, tin, tin oxide, titanium, titanium dioxide, titanium monoxide, tungsten, tungsten oxide, vanadium, ytterbium, yttrium, yttrium fluoride, zinc, zinc oxide, zinc sulfide, zirconium, zirconium oxide, copper, silver, gold, gold-tin, gold-germanium, and other metals and alloys.

Chemical vapor deposition(CVD) refers to the formation of the thin film on the substrate involves chemical reaction.  Typically, a fluid precursor moves onto the substrate and one or more chemical reactions take place, which forms a layer of the thin film.  Chemical Vapor Deposition generally uses a gas-phase precursor, often a halide or hydride of the element to be deposited.  In the case of metal-organic chemical vapor depsoisition(MOCVD), an organometallic gas is used.  Commercial techniques often use very low pressures of precursor gas.  In the case of plasma-enhanced chemical vapor deposition(PECVD), which is a special case of MOCVD,  an ionized vapor, or plasma, is used as a precursor.  Commercial PECVD relies on electromagnetic means (electric current or microwave excitation), rather than a chemical reaction, to produce a plasma. MOCVD is currently being used in the manufacturing of graphene, carbon nanotubes, LED, laser-emitting diodes, multijunction solar cell, optoelectronics, microelectronics, semiconductor, phase-change memory, photodectors, and mirco-electro-mechanical systems(MEMS).  Chemical depositon is typically much less directional, or sensitive to geometry, than physical deposition


Foils. American Elements produces rolled foils and sheets in various thicknesses and sizes. Most foils are produced from cast Ingots for use in coating and thin film Chemical Vapor Deposition (CVD) and Physical Vapor Deposition (PVD) processes including Thermal and Electron Beam (E-Beam) Evaporation, Low Temperature Organic Evaporation, Atomic Layer Deposition (ALD), Organometallic and Chemical Vapor Deposition (MOCVD) for specific applications such as fuel cells and solar energy. Scandium foils are produced from distilled scandium that does not contain tantalum. Thickness can range from 0.003" to approximately 2mm for all metals. Some metals can also be rolled down as thin as 0.001” for use as an evaporation source in microelectronics, optics, magnetics, MEMS, and hard resistant coatings. Piece sizes are available up to approximately 7" maximum width. Maximum lengths of about 20" can be obtained with a nominal thickness between about 0.005" and 0.020".
99.999% Copper Foil 99.999% Dysprosium Foil 99.999% Gold Foil

Rods and Plates. American Elements casts any of the rare earth metals and most other advanced material into rod, bar or plate form, as well as other machined shapes. All as-cast rods, bars and plates are produced from either the pure metal Ingots or sublimed metals. We have a variety of standard sized rod molds, from a minimum of 1/4" diameter up to 3" diameter for most rod needs. Plates are also offered in standard thicknesses, from 1/4" thick to 1" thick. Maximum rod lengths and maximum plate sizes are dependent on melt capacity and furnace room. Small diameter rods may have only a 4"-6" maximum cast length, whereas larger diameter rods may be cast up to about 16" long. Plate sizes can be cast up to a size of 24" x 16". As-cast rods or plates are saw-cut to length or final dimensions, and the metal surface may have visible flow marks.

Round Metallic Tubes--Selected DimensionsTubing. AE produces a complete line of fully characterized round, oval, rectangular and square seamless tubing in diameters from 0.2 to 6.0 inches and wall thicknesses from 0.003 to 0.500 inches produced from advanced and high purity metals for use in industrial and research applications in the fields of electronics, energy, medical devices and aerospace among many others. Tubing can be further processed at the customer's request to rings, washers, sleeves and sheaths. Tubing is produced from most metals including: Aluminum, Bismuth, Carbon, Cerium (as well as most other rare earths), Chromium, Cobalt, Copper, Erbium, Germanium, Gold, Indium, Iron, Magnesium, Manganese, Molybdenum, Neodymium, Nickel, Niobium, Ruthenium, Silicon, Silver, Tin, Titanium, Tungsten, Vanadium, Yttrium, Zinc, and Zirconium.

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Periodic table of the elements science and academic information, elements and advanced materials data, scientific presentations and all pages, designs, concepts, logos, and color schemes herein are the copyrighted proprietary rights and intellectual property of American Elements. American Elements is a U.S. Registered Trademark. © 1998-2012. American Elements. All rights reserved.
   
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Recent Research & Development for Sputtering Targets

Antireflection coatings for deep ultraviolet optics deposited by magnetron sputtering from Al targets. Liao BH, Lee CC. Opt Express. 2011 Apr 11;19(8):7507-12. doi: 10.1364/OE.19.007507. PMID: 21503058 [PubMed - in process]
Directional alignment of FeCo crystallites in Si/NiFe/Ru/FeCoB multilayer with high anisotropy field above 500 Oe. Hirata K, Gomi S, Nakagawa S. J Nanosci Nanotechnol. 2011 Mar;11(3):2739-42. PMID: 21449466 [PubMed - indexed for MEDLINE]

Structural and optical properties of Cu doped ZnO thin films by co-sputtering. Chung SM, Shin JH, Lee JM, Ryu MK, Cheong WS, Park SH, Hwang CS, Cho KI. J Nanosci Nanotechnol. 2011 Jan;11(1):782-6. PMID: 21446545 [PubMed]
Structural properties of lithium thio-germanate thin film electrolytes grown by radio frequency sputtering. Seo I, Martin SW. Inorg Chem. 2011 Mar 21;50(6):2143-50. Epub 2011 Feb 16. PMID: 21323361 [PubMed - indexed for MEDLINE]

[Spectrum diagnostics for optimization of experimental parameters in thin films deposited by magnetron sputtering]. Guo QL, Cui YL, Chen JH, Zhang JP, Huai SF, Liu BT, Chen JZ. Guang Pu Xue Yu Guang Pu Fen Xi. 2010 Dec;30(12):3179-82. Chinese. PMID: 21322200 [PubMed - in process]

Synthesis of gold nanoparticles in a biocompatible fluid from sputtering deposition onto castor oil. Wender H, de Oliveira LF, Feil AF, Lissner E, Migowski P, Meneghetti MR, Teixeira SR, Dupont J. Chem Commun (Camb). 2010 Oct 7;46(37):7019-21. Epub 2010 Aug 25. PMID: 20737077 [PubMed - indexed for MEDLINE]

Gas phase photocatalytic activity of ultrathin Pt layer coated on alpha-Fe2O3 films under visible light illumination. Zhang Z, Hossain MF, Miyazaki T, Takahashi T. Environ Sci Technol. 2010 Jun 15;44(12):4741-6. PMID: 20476786 [PubMed - indexed for MEDLINE]

Magnetron-sputtered Ag surfaces. New evidence for the nature of the ag ions intervening in bacterial inactivation. Mejía MI, Restrepo G, Marín JM, Sanjines R, Pulgarín C, Mielczarski E, Mielczarski J, Kiwi J. ACS Appl Mater Interfaces. 2010 Jan;2(1):230-5. PMID: 20356239 [PubMed - indexed for MEDLINE]

Growth and characterisation of NiAl and N-doped NiAl films deposited by closed field unbalanced magnetron sputtering ion plating using elemental ni and Al targets. Said R, Ahmed W, Abuain T, Abuazza A, Gracio J. J Nanosci Nanotechnol. 2010 Apr;10(4):2600-5. PMID: 20355470 [PubMed]

Closed field unbalanced magnetron sputtering ion plating of Ni/Al thin films: influence of the magnetron power. Said R, Ahmed W, Gracio J. J Nanosci Nanotechnol. 2010 Apr;10(4):2558-63. PMID: 20355462 [PubMed]

The effect of magnetron pulsing on the structure and properties of tribological Cr-Al-N coatings. Lin J, Moore JJ, Mishra B, Sproul WD, Rees JA. J Nanosci Nanotechnol. 2010 Feb;10(2):1278-85. PMID: 20352789 [PubMed]

Effect of the growth conditions on the optical and mechanical properties of TiO2 and Al2O3 films. G-Berasategui E, Bayon R, Fernandez-Diaz B, Ruiz de Gopegui U, Goikoetxea J, Zubizarreta C, Ciarsolo I, Barriga J. J Nanosci Nanotechnol. 2010 Feb;10(2):1051-6. PMID: 20352755 [PubMed]

TiO2-based nanopowders and thin films for photocatalytical applications. Radecka M, Rekas M, Kusior E, Zakrzewska K, Heel A, Michalow KA, Graule T. J Nanosci Nanotechnol. 2010 Feb;10(2):1032-42. PMID: 20352753 [PubMed]

Laser-plasma debris from a rotating cryogenic-solid-Xe target. Amano S, Inaoka Y, Hiraishi H, Miyamoto S, Mochizuki T. Rev Sci Instrum. 2010 Feb;81(2):023104. PMID: 20192482 [PubMed]

Micromachining tools and correlative approaches for cellular cryo-electron tomography. Rigort A, Bäuerlein FJ, Leis A, Gruska M, Hoffmann C, Laugks T, Böhm U, Eibauer M, Gnaegi H, Baumeister W, Plitzko JM. J Struct Biol. 2010 Nov;172(2):169-79. Epub 2010 Feb 21. PMID: 20178848 [PubMed - in process]

Processing, structure, and properties of nanostructured multifunctional tribological coatings. Lin J, Park IW, Mishra B, Pinkas M, Moore JJ, Anton JM, Kim KH, Voevodin AA, Levashov EA. J Nanosci Nanotechnol. 2009 Jul;9(7):4073-84. PMID: 19916411 [PubMed]

Structure and properties of Al-doped ZnO transparent conductive thin-films prepared by asymmetric bipolar pulsed DC reactive magnetron sputtering. Hsu FY, Chen TH, Peng KC. J Nanosci Nanotechnol. 2009 Jul;9(7):4008-15. PMID: 19916401 [PubMed]

Mechanical characterization of a functionally graded nanocomposite thin film. Piedade AP, Nunes J, Vieira MT. J Nanosci Nanotechnol. 2009 Jun;9(6):3792-7. PMID: 19504921 [PubMed]

Ti/Al nanolayered thin films. Ramos AS, Vieira MT, Serra C. J Nanosci Nanotechnol. 2009 Jun;9(6):3627-32. PMID: 19504893 [PubMed]

Coupling of morphology to surface transport in ion-beam-irradiated surfaces: normal incidence and rotating targets. Muñoz-García J, Cuerno R, Castro M. J Phys Condens Matter. 2009 Jun 3;21(22):224020. Epub 2009 May 12. PMID: 21715758 [PubMed - in process]

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