Tungsten Alloy-Tungsten Alloys Manufacturer and Supplier
Hanns CEO/Chinatungten.com
2012/03/27
Tungsten Carbides Powders
Tungsten Carbides Powders
Tungsten carbide powder applied to gate valves.Wear Resistant Thermal Spray Coatings of tungsten carbide are used for their hardness and wear resistance. When choosing a Tungsten Carbide Powder, the particle size and type of carbide selected are important in determining the correct material to combat various forms of erosion, abrasion and wear. Whereas the amount of metal matrix in the coating (nickel, cobalt, or alloy) will depend on the toughness and abrasion resistance required.
88 WC/ 12 Co
Good erosion, sliding and fretting wear resistance protection for applications under 1000F. Not for use in corrosive or impact applications. Used for machine parts, pump housing, fan blades, etc.
| Product | Detail |
| LA-3301 | -325 +15µ 89 WC / 11 Co |
| LA-3301-C | -270 +15µ 89 WC / 11 Co |
| Morphology | Sintered and Crushed |
| Method | Air Plasma Spray, HVOF |
| Equivalents | WC-106, Stellite JK-114 |
| Product | Detail |
| LA-3302 | -200 +325 88 WC / 12 Co |
| LA -3302-C | -100+200 88 WC/ 12 Co |
| Morphology | Sintered and Crushed |
| Method | Air Plasma Spray, HVOF |
| Equivalents | Sulzer Metco 71-NS, Diamalloy 2003, AMDRY 302 Tafa WC-104, Amperit 515.401 |
| Approvals | PWA 1302 |
| Product | Detail |
| LA-3072 | -325 + 5µ 88 WC / 12 Co |
| Morphology | Sintered and Crushed |
| Method | Air Plasma Spray, HVOF |
| Equivalents | Sulzer Metco 2004 |
| Product | Detail |
| -325 + 15µ 88 WC / 12 Co | |
| Morphology | Sintered and Crushed |
| Method | Air Plasma Spray, HVOF |
| Equivalents | Sulzer Metco 72SF-NS, AMDRY 927, Tafa WC-489-1, Stellite JK-112, Amperit 515.1, 515.400 |
| Approvals | AMS-7880 GE B50TF27-A/B |
| Product | Detail |
| LA-3372S | -270+15 88 WC / 12 Co |
| Morphology | Agglomerated and Sintered |
| Method | HVOF |
| Equivalents | Sulzer Metco HC Stark 514.074, JK 112, Amperit 514.074, Woka 3101 |
| Product | Detail |
| LA-3379 | -325+5, -270+15 89 WC/ 11 Co |
| Morphology | Sintered and Crushed |
| Specifications | PWA 1379 |
| Method | Air Plasma Spray, HVOF |
| Equivalents | Metco 71VF NS, Amdry 301, WC-106 |
| Approvals | PWA 1379 |
83 WC / 17 Co
Tungsten Carbide coatings have higher toughness, ductility and fretting resistance than coatings of 88/12. Appropriate for non-corrosive applications under 1000F.
| Product | Detail |
| LA-3073 | -325 +5µ 83 WC / 17 Co |
| Morphology | Sintered and Crushed |
| Method | Air Plasma Spray, HVOF |
| Equivalents | Amperit 525.1, Diamalloy 2005 |
| Product | Detail |
| LA-3373 | -270 +5µ 83 WC / 17 Co |
| Morphology | Sintered and Crushed |
| Equivalents | Metco 73F NS, WC 128 |
| Approvals | AMS 2447, Bell BPS 4463, Honeywell PS 1401 |
| Product | Detail |
| LA-3373S | -270 +15µ 83 WC / 17 Co |
| Morphology | Agglomerated and Sintered |
| Method | HVOF |
| Equivalents | Diamalloy 2004, Amdry 9830, Sulzer 73F, Woka 3201, 3206, TAFA 1343VF, JK 117, Amperit 526.062 |
80 WC / 20 Co
Appropriate for applications under 1000F. Recommended for gripping and traction applications that requiring a coarse coating.
| Product | Detail |
| LA-3374 | -270+5µ 80 WC/ 20 Co |
| Morphology | Sintered and Crushed |
| Method | Combustion |
| Equivalents | Metco 76F NS, Amdry 985 |
86 WC/ 10 Co/ 4 Cr
Appropriate for applications under 1000°F. CoCr matrix has higher abrasion and corrosion resistance than Co. Hard chrome replacement. Used on rolls, gate valves and seats, ball valves.
| Product | Detail |
| LA-3086 | -325+5µ 86 WC/10 Co/ 4Cr |
| Morphology | Sintered and Crushed |
| Method | Air Plasma Spray, HVOF |
| Equivalents | Amperit 554.074 |
| Product | Detail |
| -325+15µ 86 WC/10 Co/ 4Cr | |
| Morphology | Sintered and Crushed |
| Method | HVOF |
| Equivalents | Amdry 5843, WC-436-1, JK 120, Amperit 554.074 |
| Approvals | BOEING BMS 10-67K TYPE 17, MESSIER DOWTY PCS-2561, GOODRICH LGMS 9011-A BPS 4013 Type III Class B BPS 4013 Type III Class B |
| Product | Detail |
| -270+15µ 86 WC/10 Co/ 4 Cr | |
| Morphology | Sintered and Crushed |
| Method | HVOF |
| Product | Detail |
| -270+15µ 86 WC/10 Co/ 4Cr | |
| Morphology | Agglomerated and Sintered |
| Equivalents | Amdry 5847, 1350-VM, JK 120 |
90 WC/ 10 Ni
Appropriate for applications under 1000°F. Nickel matrix WC has higher corrosion resistance than Cobalt. Applications include ball valves and seats. Hard chrome replacement.
| Product | Detail |
| -325+15µ 90 WC/ 10 Ni | |
| Morphology | Sintered and crushed |
| Method | HVOF |
| Equivalents | 1310VM, JK-6189, mperit 547.074, Woka 3301 |
| Product | Detail |
| LA-3N10-S | -325+15u 90WC/10 Ni |
| Morphology | Agglomerated and Sintered |
| Method | HVOF |
| Equivalents | 1310VM, JK-6189, Amperit 547.074, Woka 3301 |
70 WC/ 20 Cr3C2/ 6 Ni
| Product | Detail |
| LA-3085 | -325+5µ 74 WC/ 20 Cr3C2 C2/ 6 Ni |
| Morphology | Sintered |
| Method | Air Plasma Spray, HVOF |
| Equivalent | WC-496, JK 125 |
| Coatings of LA 3085 are resistant to abrasion, solid particle erosion, cavitation and fretting wear up to about 1800F in addition to being resistant to sour gas. Applications include chrome replacement. | |
| Product | Detail |
| LA-3385 | -325+15µ 74 WC/ 20 Cr3C2 C2/ 6Ni |
| Morphology | Sintered |
| Method | HVOF |
| Equivalents | WC-496, JK 125 |
75 WCCo / Nickel Super Alloy Blend
| Product | Detail |
| LA-3303 | -325+11 WC/ 12 Co/ Ni Based Super Alloy |
| Method | HVOF |
| Equivalents | Metco 5803, Stelcar 6806 |
| Coatings of LA-3303 are excellent hard chrome replacement for applications under 1000°F. Resistant to cracking, fretting and abrasion. | |
The Drilled Gold Bars Filled With Tungsten
The Drilled Gold Bars Filled With Tungsten
The first mainstream report that I saw was by Felix Salmon at Reuters. And there’s two parts to that story.
Firstly, I wouldn’t be surprised if someone has attempted to do the substitution. It’s been known for a long time that the densities of tungsten and gold are close enough that in theory, drilling out a hallmarked gold bar and replacing the interior with tungsten could fool all but the most sophisticated of tests.
You can see the purported photos of the bar that has been found here. Following the story around the claim is made by ABC Bullion that a Swiss refiner (and producer of good delivery bars to the London gold market) MKS had sent out the warning email last week. Which, at least as of lunchtime today was something of a surprise to MKS as when I spoke to them they had no idea about it all. There were quite a lot of people like me asking about it but they had no idea whether the story was true, whether someone in their company had sent it, no real idea of what was going on at all. They were quite mystified in fact.
But as I’ve said, in theory this sort of thing is possible even if it would be very difficult to do in practice. Further, I’m not really sure that the economics of it quite work out either. Sure, tungsten is vastly cheaper than gold but this would be very skilled work with a low success rate and the gross profits are a few thousand $ per 1 kg bar so treated. It’s most certainly not a 5 minute job either. Nor mechanisable. Just not sure that it would be worth it.
Where the story goes off into fantasy though is here (and Felix is correct in the questions he asks to try and work out prevalence):
If there are 1.3 million salted 400 oz bars in existence, and each one is 75% tungsten, then that makes 390 million ounces of gold which in truth isn’t there. At $1,660 per ounce, that’s over $600 billion which people think they own but don’t. To put that number in context, it’s roughly half the total quantity of subprime mortgages which had been issued at the height of the housing bubble.The answer to this comes from a commenter there:
The amount of turnover in the market is much higher than you think. In the case of the professional market which deals in 400oz bars, yes many of these sit in central bank vaults but many others are held by private investors and these are traded. There has been no occurrences in my 18 years in the industry, and I haven’t heard of others, of fake 400oz gold bars. Any bar coming out of a LBMA accredited refinery can be trusted because the refinery cannot control or know where the bar will end up and during its life there is a good chance a bar will eventually be melted for use by a jeweller or other refiner and as such there is a high probability of being caught out.I would take that even further. Even the ingots in central banks, or in gold vaults, sometimes get sent off to be refined. For the very same reason those vaults are regularly vacuumed for the trace amounts of gold that have rubbed/been chipped off the ingots. It’s absolutely true that gold doesn’t oxidise or decompose, but as bars are moved around then they inevitably get bumped and after enough of that they are likely to get sent of for refining so as to maintain their good delivery characteristics. And no, a tungsten filled bar would not be refined without someone noticing.
In the retail market I’d guess that turnover is a lot higher, particularly as retail investors do tend to exhibit herding behaviour, which means when there is selling it usually overwhelms retail buyers at that point in time. The end result is that in a net selling situation dealers do not sit on gold due to the high holding costs vs low profit margins and uncertainty as to when buying demand will return, so they liquidate that net selling excess back to refiners, where it is melted. Thus there is a fair bit of turnover and again, a good chance of fakes being detected.
If I were to assign percentages here I’d say that someone trying to drill out a bar and fill it with tungsten would be up near 100%. I’m sure the idea has occurred to lots of people independently. As to this being a common occurrence among good delivery bars I’d put it down somewhere near zero. There’s just too much turnover of bars through the refineries for this to be possible.
Colleted by Hanns CEO/Chinatungten.com
Tungsten Carbide Sputtering Target
Tungsten Carbide Sputtering Target
WC 7440-02-0
| Product | Product Code | Specification |
| (2N) 99% Tungsten Carbide Sputtering Target | W-C-02-ST | |
| (2N5) 99.5% Tungsten Carbide Sputtering Target | W-C-025-ST | |
| (3N) 99.9% Tungsten Carbide Sputtering Target | W-C-03-ST | |
| (3N5) 99.95% Tungsten Carbide Sputtering Target | W-C-035-ST | |
| (4N) 99.99% Tungsten Carbide Sputtering Target | W-C-04-ST | |
| (5N) 99.999% Tungsten Carbide Sputtering Target | W-C-05-ST |
American Elements produces to many standard grades when applicable, including Mil Spec (military grade); ACS, Reagent and Technical Grade; Food, Agricultural and Pharmaceutical Grade; Optical Grade, USP and EP/BP (European Pharmacopeia/British Pharmacopeia) and follows applicable ASTM testing standards.See safety data and research below and pricing/lead time above. American Elements specializes in producing high purity Tungsten Carbide Sputtering Targets with the highest possible density and smallest possible average grain sizes for use in semiconductor, chemical vapor deposition (CVD) and physical vapor deposition (PVD) display and optical applications. Our standard target sizes range from 1" to 8" in diameter and from 2mm to 1/2" thick. "Sputtering" allows for thin film deposition of an ultra high purity sputtering metallic or oxide material onto another solid substrate by the controlled removal and conversion of the target material into a directed gaseous/plasma phase through ionic bombardment. We can also provide targets outside this range in addition to just about any size rectangular, annular, or oval target. Materials are produced using crystallization, solid state and other ultra high purification processes such as sublimation. American Elements specializes in producing custom compositions for commercial and research applications and for new proprietary technologies. American Elements also casts any of the rare earth metals and most other advanced materials into rod, bar or plate form, as well as other machined shapes and through other processes such as nanoparticles (See also application discussion at Nanotechnology Information and at Quantum Dots) and in the form of solutions and organometallics. We also produce Tungsten as rods, powder and plates. Other shapes are available by request.
Tungsten is a Block D, Group 6, Period 6 element. The number of electrons in each of Tungsten's shells is 2, 8, 18, 32, 12, 2 and its electronic configuration is [Xe] 4f14 5d4 6s2. In its elemental form tungsten's CAS number is 7440-33-7. The tungsten atom has a radius of 137.pm and it's Van der Waals radius is 200.pm. Tungsten is considered to be only mildly toxic. Tungsten has the highest melting point of all the metallic elements and because of this has its first significant commercial application as the filament in incandescent light bulbs and fluorescent light bulbs. Tungsten is available as metal and compounds with purities from 99% to 99.999% (ACS grade to ultra-high purity); metals in the form of foil, sputtering target, and rod, and compounds as submicron and nanopowder. Later it was used in the first television tubes. The first imaging equipment involved X-ray bombardment of a tungsten target. Tungsten expands at nearly the same rate as borosilicate glass and is used to make metal to glass seals. It is the primary metal in heating elements for electric furnaces and in any components where high pressure/temperature environments are expected, such as aerospace and engine systems. Tungsten was first discovered by Fausto and Juan Jose de Elhuyar in 1783. In reference to its density, Tungsten gets its name from the swedish words tung and sten meaning heavy stone. See Tungsten research below.
| Formula | CAS No. | Appearance | Molecular Weight |
| WC | 7440-02-0 | Metal | |
| Recent Research & Development for Tungsten Gas nanosensor design packages based on tungsten oxide: mesocages, hollow spheres, and nanowires. Hoa ND, El-Safty SA. Nanotechnology. 2011 Dec 2;22(48):485503. Epub 2011 Nov 9. PMID: 22071572 [PubMed - in process] Experimental hypothyroidism delays fEPSPs and disrupts hippocampal long-term potentiation in the dentate gyrus of hippocampal formation and Y-maze performance in adult rats. Seda Artis A, Bitiktas S, Taskin E, Dolu N, Liman N, Suer C. J Neuroendocrinol. 2011 Nov 9. doi: 10.1111/j.1365-2826.2011.02253.x. [Epub ahead of print] PMID: 22070634 [PubMed - as supplied by publisher] Glycolaldehyde as a Probe Molecule for Biomass-derivatives: Reaction of C-OH and C=O Functional Groups on Monolayer Ni Surfaces. Yu W, Barteau MA, Chen JG. J Am Chem Soc. 2011 Nov 8. [Epub ahead of print] PMID: 22066750 [PubMed - as supplied by publisher] [Bis-(4-methyl-1,3-thia-zol-2-yl-?N)methane]-tricarbonyl-dichlorido-tungsten(II). Strasser CE, Cronje S, Raubenheimer HG. Acta Crystallogr E Struct Rep Online. 2011 Oct 1;67(Pt 10):m1460. Epub 2011 Sep 30. PMID: 22065685 [PubMed] Carbon nanotube composite coating of neural microelectrodes preferentially improves the multiunit signal-to-noise ratio. Baranauskas G, Maggiolini E, Castagnola E, Ansaldo A, Mazzoni A, Angotzi GN, Vato A, Ricci D, Panzeri S, Fadiga L. J Neural Eng. 2011 Nov 8;8(6):066013. [Epub ahead of print] PMID: 22064890 [PubMed - as supplied by publisher] Use of carbon nanotubes and electrothermal atomic absorption spectrometry for the speciation of very low amounts of arsenic and antimony in waters. López-García I, Rivas RE, Hernández-Córdoba M. Talanta. 2011 Oct 30;86:52-7. Epub 2011 Aug 27. PMID: 22063510 [PubMed - in process] Mechanism of W(CO)(6) sonolysis in diphenylmethane. Cau C, Nikitenko SI. Ultrason Sonochem. 2011 Oct 19. [Epub ahead of print] PMID: 22054911 [PubMed - as supplied by publisher] Synthesis of macrocyclic natural products by catalyst-controlled stereoselective ring-closing metathesis. Yu M, Wang C, Kyle AF, Jakubec P, Dixon DJ, Schrock RR, Hoveyda AH. Nature. 2011 Nov 2;479(7371):88-93. doi: 10.1038/nature10563. PMID: 22051677 [PubMed - in process] Combinatorial atmospheric pressure chemical vapor deposi-tion (cAPCVD); a route to functional property optimization. Kafizas A, Parkin IP. J Am Chem Soc. 2011 Nov 4. [Epub ahead of print] PMID: 22050427 [PubMed - as supplied by publisher] Comparative evaluation of marginal adaptation between nanocomposites and microhybrid composites exposed to two light cure units. Sharma RD, Sharma J, Rani A. Indian J Dent Res. 2011 May;22(3):495. PMID: 22048600 [PubMed - in process] Comparison of secondary neutron dose in proton therapy resulting from the use of a tungsten alloy MLC or a brass collimator system. Diffenderfer ES, Ainsley CG, Kirk ML, McDonough JE, Maughan RL. Med Phys. 2011 Nov;38(11):6248. PMID: 22047390 [PubMed - in process] Vector potential photoelectron microscopy. Browning R. Rev Sci Instrum. 2011 Oct;82(10):103703. PMID: 22047299 [PubMed - in process] Structural Effects Behind the Low Temperature Nonconventional Relaxor Behavior of the Sr(2)NaNb(5)O(15) Bronze. Torres-Pardo A, Jiménez R, González-Calbet JM, García-González E. Inorg Chem. 2011 Oct 28. [Epub ahead of print] PMID: 22035503 [PubMed - as supplied by publisher] Accelerated electron beam induced breakdown of commercial WO(3) into nanorods in the presence of triethylamine. Dawson G, Zhou W, Blackley R. Phys Chem Chem Phys. 2011 Oct 27. [Epub ahead of print] PMID: 22030615 [PubMed - as supplied by publisher] Multilayer chitosan-based open tubular capillary anion exchange column with integrated monolithic capillary suppressor. Huang X, Foss FW Jr, Dasgupta PK. Anal Chim Acta. 2011 Nov 30;707(1-2):210-7. Epub 2011 Sep 24. PMID: 22027141 [PubMed - in process] Multispectral near-IR reflectance and transillumination imaging of teeth. Chung S, Fried D, Staninec M, Darling CL. Biomed Opt Express. 2011 Oct 1;2(10):2804-14. Epub 2011 Sep 15. PMID: 22025986 [PubMed] Efficient Heterogeneous Epoxidation of Alkenes by a Supported Tungsten Oxide Catalyst. Kamata K, Yonehara K, Sumida Y, Hirata K, Nojima S, Mizuno N. Angew Chem Int Ed Engl. 2011 Oct 25. doi: 10.1002/anie.201106064. [Epub ahead of print] No abstract available. PMID: 22025368 [PubMed - as supplied by publisher] Structural transformation of tungsten oxide nanourchins into IF-WS(2) nanoparticles: an aberration corrected STEM study. Leonard-Deepak F, Castro-Guerrero CF, Mejía-Rosales S, José-Yacamán M. Nanoscale. 2011 Oct 24. [Epub ahead of print] PMID: 22025289 [PubMed - as supplied by publisher] Academic aspects of lunar water resources and their relevance to lunar protolife. Green J. Int J Mol Sci. 2011;12(9):6051-76. Epub 2011 Sep 19. PMID: 22016644 [PubMed - in process] |
Evaluation of ocular hazards from 4 types of curing lights. Labrie D, Moe J, Price RB, Young ME, Felix CM. J Can Dent Assoc. 2011 Oct;77:b116. PMID: 22014874 [PubMed - in process
Collected by Hanns CEO / Chinatungten Online
TUNGSTEN SPUTTERING TARGET
TUNGSTEN SPUTTERING TARGET, ROTATABLE SPUTTERING TARGETS, THIN FILM, FOIL, DEPOSITION MATERIAL, EVAPORATION MATERIALS, ROD, WIRE, BAR, SHEET, INGOT, PLATE
Tungsten Sputtering Deposition
Uses & Applications for Tungsten Sputtering Targets
Deposition Methods that do not Require Tungsten Sputtering Targets
Tungsten Carbide Sputtering Target
Tungsten Oxide Rotatable Sputtering Target
Tungsten Oxide Sputtering Target
Tungsten Rotatable Sputtering Target
Tungsten Silicon Sputtering Target
Tungsten Sputtering Target
Tungsten Titanium Sputtering Target
Sputtering Target, Foil, Rod, Wire, Bar, Sheet, Plate and < 0.5 mm Thin Film from rare earth and other electronic and optic materials. American Elements produces high purity metals and compounds with the highest possible density and smallest possible average grain sizes for use in semiconductor, chemical deposition and physical vapor deposition (PVD) display and optical applications. We also produce the rare earths and most advanced metals as cast rods and plates.99.999% Gold Foil for chemical vapor deposition
Materials are produced using crystallization, solid state and other ultra high purification processes. American Elements specializes in producing custom compositions for research and new proprietary technologies.
Indium Sputtering Target
Sputtering Targets. Our standard target sizes range from 1" to 8" in diameter and from 2mm to 1/2" thick. We can also provide targets outside this range in addition to just about any size rectangular, annular, or oval target. Materials are produced using crystallization, solid state and other ultra high purification processes such as sublimation. American Elements specializes in producing custom compositions for commercial and research applications and for new proprietary technologies. American Elements also casts any of the rare earth metals and most other advanced materials into rod, bar or plate form, as well as other machined shapes and through other processes such as nanoparticles (See also application discussion at Nanotechnology Information and at Quantum Dots) and in the form of solutions and organometallics. Other shapes are available by request.
Rotatable Targets. For large area thin film deposition, American Elements produces rotatable sputtering targets by plasma deposition onto a tubular substrate and by casting. Rotatable sputtering targets are available up to 1,000 mm in length and can be produced from a number of metallic, oxide and alloy sources for use in many applications where large film areas are required, such as photovoltaic and other coatings.
All machined pieces are produced by casting oversized blanks, and machining down to required specifications. They are usually machined to tolerances of +0.010"/-0" on diameter, length or width, and +/-0.005" on thickness. Larger targets are also finished to a flatness within 0.015". We can accommodate tighter tolerances upon request.
SPUTTERING DEPOSITION
Sputtering deposition uses a plasma, which is usually formed from a non-reactive gas, to bombard the target material for the thin film and knock the atoms of the target material out of its bulk. The ejected atoms then land on the substrate and form a thin film. Since the target does not need to be heated, the technique is very flexible for a wide range of applications. The targets can even be made of compounds or mixtures, not just pure elements.
USES & APPLICATIONS FOR SPUTTERING TARGETS
Uses & applications for sputtering targets and other evaporation materials have continued to expand. The most recent uses are described below and in the new PBS NOVA series "Making Stuff". When relevant, properties and the latest research is also covered.
Electronics and Semiconductors. The first commercial use for the sputtering target was in semiconductors and electronics for front end and back end packaging, diffusion barriers, compounds, phase change memory, IC interconnects, micro contacts, and in sensors, MEMs and LEDs. Sputtering targets and evaporation materials of copper and copper alloys including copper-nickel, copper-chromium are manufactured for packaging and other applications, as well as, nickel and many nickel alloys including nickel-aluminum, nickel-vanadium, nickel-platinum, nickel-copper and nickel-chromium. Aluminum is available In its elemental form and alloyed with copper and silicon as aluminum-copper, aluminum-silicon and aluminum-copper-silicon. Elemental titanium is available up to 99.999% purity and alloyed in titanium-tungsten. The conductive and solder wetting properties of gold make it an important deposition material, including gold alloys such as gold-tin, gold-antimony, gold-silicon, gold-copper, and gold-germanium. Recent materials include Phase Change Alloys such as germanium-antimony alloyed with tellurium, silver, indium and platinum and transparent conductive oxides (TCO) for light emitting applications such as sensors and light emitting diodes (LED). These include indium-tin oxide (ITO) and zinc oxide doped with aluminum and other elements (ZnO). American Elements also produces ultra high purity sputtering targets and other evaporation materials for electronic applications including hafnium, molybdenum, silver, iridium, rhodium and ruthenium.
Anti-abrasive coatings for Wear Protection. Electroplating of tool, die, drilling and cutting tool active surfaces to protect against wear and extend life has given way in recent years to the deposition of these coating materials as a more cost effective alternative. Typical protective materials using sputtering targets and other evaporation materials include titanium, titanium carbide, silicon carbide, boron carbide, aluminum, nickel, chromium and tungsten carbide.
Magnetic Materials. The use of high strength magnets have found application is numerous industries including automotive, aerospace, biomedical imaging and auditory engineering. sputtering targets and other evaporation materials of these advanced magnetic materials are manufactured by American Elements from samarium cobalt and neodymium iron boron alloy.
Optical and Architectural Glass. The ability of certain elements to selectively absorb and emit highly specific wave length ranges and also reduce glare due to their high refractive index when deposited on a glass substrate resulted in the development of sputtering and evaporation materials of elemental rare earths, such as neodymium and dysprosium and many other optically active and anti-reflective (AR) materials. More recently, architectural glass for residential, commercial and office building applications has benefited from the availability of these same coatings.
Photovoltaic Solar Energy Panels. The three primary solar energy technologies, silicon based, Copper Indium Selenide (CIS) and Copper Indium Gallium Selenide (CIGS) are layered structures that require sputtering targets and other evaporation materials at several stages including certain transparent conductive oxides (TCO) such as indium tin oxide (ITO) and doped zinc oxide as the top electrode, molybdenum as the back plate, and antimony telluride and zinc telluride in CIS and CIG photovoltaic cells.
Solid Oxide Fuel Cells. Typical solid oxide fuel cell (SOFC) designs contain an electronically conductive low density cathode, a high density, ionically conductive electrolyte and an electronically conductive open air electrode. New technology is being developed for the deposition of these layers. Sputtering targets are produced by American Elements to meet the needs of each of these layers including Perovskite cathode materials including Lanthanum Strontium Manganite (LSM), Lanthanum Strontium Ferrite (LSF), Lanthanum Strontium Cobaltite Ferrite (LSCF), Lanthanum Strontium Chromite (LSC), and Lanthanum Strontium Gallate Magnesite (LSGM) with doping levels and other parameters to customer specifications and ionically conductive electrolytes including YSZ (Yttria stabilized Zirconia), SCZ (Scandium doped Zirconia), Samarium doped Ceria, Gadolinium doped Ceria and Yttrium doped Ceria. These fuel cells materials are marketed under the trademark AE Fuel Cells.
Data Storage. Sputtering targets and other evaporation materials are now essential to the coating and manufacturing of optical storage devices such as CDs and DVDs to provide both wear protection and reflectivity.
DEPOSITION METHODS THAT DO NOT REQUIRE SPUTTERING TARGETS
Pulsed laser deposition (PLD) uses pulses of a high-power laser beam to ablate the target material. The material on the target surface is instantly evaporated and turned into plasma, and it returns back to vapor phase. Finally, the ablated material then collects and deposits on top of a correctly placed substrate. This technique has the advatages over the others in that it preserves the stoichiometry of the target on the film formed and the rate of deposition is higher than the others.
Physical vapor deposition (PVD). PVD refers to the purely physical formation of the thin film on top of the substrate, there should be no chemical reactionUltra High Purity Cadmium Telluride Bouleinvolved in the formation of the thin film. Typically PVD is done in a low-pressure environment, though there are a number of PVD techniques. Evaporation deposition raises the temperature of material of thin film so its vapor pressure reaches a useful range. The vapor then moves and deposits on top of the substrate of interest. Electron Beam Evaporation a form of PVD in which the target anode is bombarded with an electron beam given off by a charged tungsten filament under high vacuum. The electrion beam causes atoms from the target material to transform into a gaseous phase, these atoms then return to solid form coating everything in the vacuum chamber with a thin film. It can also be used in conjuction with molecular beam epitaxy (MBE).
Electron beam evaporation research applications include medical, metallurgical, telecommunication, microelectronics, optical coating, nanotechnology and semiconductor industries. Typical source materials include titanium, platinum, aluminum, aluminum oxide, antimony, barium, bismuth, boron, boron carbide, calcium, cerium, chromium, chromium oxide, cobalt, dysprosium, erbium, gadolinium, hafnium, hafnium oxide, indium, indium tin oxide, iridium, iron, lead, lithium, lithium fluoride, magnesium, magnesium fluroide, magnesium oxide, manganese, molybdenum, neodymium, nickel, nickel-chromium, nickel iron, niobium, palladium, permalloy hymu 80 (Fe-Mn-Mo-Ni), rhenium, rhodium, ruthenium, samarium, scandium, selenium, silicon, silicon dioxide, silicon monoxide, strontium, tantalum, tantalum oxide, tin, tin oxide, titanium, titanium dioxide, titanium monoxide, tungsten, tungsten oxide, vanadium, ytterbium, yttrium, yttrium fluoride, zinc, zinc oxide, zinc sulfide, zirconium, zirconium oxide, copper, silver, gold, gold-tin, gold-germanium, and other metals and alloys.
Chemical vapor deposition(CVD) refers to the formation of the thin film on the substrate involves chemical reaction. Typically, a fluid precursor moves onto the substrate and one or more chemical reactions take place, which forms a layer of the thin film. Chemical Vapor Deposition generally uses a gas-phase precursor, often a halide or hydride of the element to be deposited. In the case of metal-organic chemical vapor depsoisition(MOCVD), an organometallic gas is used. Commercial techniques often use very low pressures of precursor gas. In the case of plasma-enhanced chemical vapor deposition(PECVD), which is a special case of MOCVD, an ionized vapor, or plasma, is used as a precursor. Commercial PECVD relies on electromagnetic means (electric current or microwave excitation), rather than a chemical reaction, to produce a plasma. MOCVD is currently being used in the manufacturing of graphene, carbon nanotubes, LED, laser-emitting diodes, multijunction solar cell, optoelectronics, microelectronics, semiconductor, phase-change memory, photodectors, and mirco-electro-mechanical systems(MEMS). Chemical depositon is typically much less directional, or sensitive to geometry, than physical deposition
Foils. American Elements produces rolled foils and sheets in various thicknesses and sizes. Most foils are produced from cast Ingots for use in coating and thin film Chemical Vapor Deposition (CVD) and Physical Vapor Deposition (PVD) processes including Thermal and Electron Beam (E-Beam) Evaporation, Low Temperature Organic Evaporation, Atomic Layer Deposition (ALD), Organometallic and Chemical Vapor Deposition (MOCVD) for specific applications such as fuel cells and solar energy. Scandium foils are produced from distilled scandium that does not contain tantalum. Thickness can range from 0.003" to approximately 2mm for all metals. Some metals can also be rolled down as thin as 0.001” for use as an evaporation source in microelectronics, optics, magnetics, MEMS, and hard resistant coatings. Piece sizes are available up to approximately 7" maximum width. Maximum lengths of about 20" can be obtained with a nominal thickness between about 0.005" and 0.020".
99.999% Copper Foil 99.999% Dysprosium Foil 99.999% Gold Foil
Rods and Plates. American Elements casts any of the rare earth metals and most other advanced material into rod, bar or plate form, as well as other machined shapes. All as-cast rods, bars and plates are produced from either the pure metal Ingots or sublimed metals. We have a variety of standard sized rod molds, from a minimum of 1/4" diameter up to 3" diameter for most rod needs. Plates are also offered in standard thicknesses, from 1/4" thick to 1" thick. Maximum rod lengths and maximum plate sizes are dependent on melt capacity and furnace room. Small diameter rods may have only a 4"-6" maximum cast length, whereas larger diameter rods may be cast up to about 16" long. Plate sizes can be cast up to a size of 24" x 16". As-cast rods or plates are saw-cut to length or final dimensions, and the metal surface may have visible flow marks.
Round Metallic Tubes--Selected DimensionsTubing. AE produces a complete line of fully characterized round, oval, rectangular and square seamless tubing in diameters from 0.2 to 6.0 inches and wall thicknesses from 0.003 to 0.500 inches produced from advanced and high purity metals for use in industrial and research applications in the fields of electronics, energy, medical devices and aerospace among many others. Tubing can be further processed at the customer's request to rings, washers, sleeves and sheaths. Tubing is produced from most metals including: Aluminum, Bismuth, Carbon, Cerium (as well as most other rare earths), Chromium, Cobalt, Copper, Erbium, Germanium, Gold, Indium, Iron, Magnesium, Manganese, Molybdenum, Neodymium, Nickel, Niobium, Ruthenium, Silicon, Silver, Tin, Titanium, Tungsten, Vanadium, Yttrium, Zinc, and Zirconium.
PRODUCT CATALOG
U.S. Operations
Foil Price Quote Tolling Ultra High Purity Sputtering Target Crystal Growth Advanced Materials Information Center Home
German Korean French Japanese Spanish Chinese (Simplified) Portuguese Russian Chinese (Taiwan) Italian Turkish Polish Dutch Czech Swedish Hungarian Danish Hebrew
Production Catalog Available in 36 Countries & Languages
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Periodic table of the elements science and academic information, elements and advanced materials data, scientific presentations and all pages, designs, concepts, logos, and color schemes herein are the copyrighted proprietary rights and intellectual property of American Elements. American Elements is a U.S. Registered Trademark. © 1998-2012. American Elements. All rights reserved.
Reach Lean Sigma
Recent Research & Development for Sputtering Targets
Antireflection coatings for deep ultraviolet optics deposited by magnetron sputtering from Al targets. Liao BH, Lee CC. Opt Express. 2011 Apr 11;19(8):7507-12. doi: 10.1364/OE.19.007507. PMID: 21503058 [PubMed - in process]
Directional alignment of FeCo crystallites in Si/NiFe/Ru/FeCoB multilayer with high anisotropy field above 500 Oe. Hirata K, Gomi S, Nakagawa S. J Nanosci Nanotechnol. 2011 Mar;11(3):2739-42. PMID: 21449466 [PubMed - indexed for MEDLINE]
Structural and optical properties of Cu doped ZnO thin films by co-sputtering. Chung SM, Shin JH, Lee JM, Ryu MK, Cheong WS, Park SH, Hwang CS, Cho KI. J Nanosci Nanotechnol. 2011 Jan;11(1):782-6. PMID: 21446545 [PubMed]
Structural properties of lithium thio-germanate thin film electrolytes grown by radio frequency sputtering. Seo I, Martin SW. Inorg Chem. 2011 Mar 21;50(6):2143-50. Epub 2011 Feb 16. PMID: 21323361 [PubMed - indexed for MEDLINE]
[Spectrum diagnostics for optimization of experimental parameters in thin films deposited by magnetron sputtering]. Guo QL, Cui YL, Chen JH, Zhang JP, Huai SF, Liu BT, Chen JZ. Guang Pu Xue Yu Guang Pu Fen Xi. 2010 Dec;30(12):3179-82. Chinese. PMID: 21322200 [PubMed - in process]
Synthesis of gold nanoparticles in a biocompatible fluid from sputtering deposition onto castor oil. Wender H, de Oliveira LF, Feil AF, Lissner E, Migowski P, Meneghetti MR, Teixeira SR, Dupont J. Chem Commun (Camb). 2010 Oct 7;46(37):7019-21. Epub 2010 Aug 25. PMID: 20737077 [PubMed - indexed for MEDLINE]
Gas phase photocatalytic activity of ultrathin Pt layer coated on alpha-Fe2O3 films under visible light illumination. Zhang Z, Hossain MF, Miyazaki T, Takahashi T. Environ Sci Technol. 2010 Jun 15;44(12):4741-6. PMID: 20476786 [PubMed - indexed for MEDLINE]
Magnetron-sputtered Ag surfaces. New evidence for the nature of the ag ions intervening in bacterial inactivation. Mejía MI, Restrepo G, Marín JM, Sanjines R, Pulgarín C, Mielczarski E, Mielczarski J, Kiwi J. ACS Appl Mater Interfaces. 2010 Jan;2(1):230-5. PMID: 20356239 [PubMed - indexed for MEDLINE]
Growth and characterisation of NiAl and N-doped NiAl films deposited by closed field unbalanced magnetron sputtering ion plating using elemental ni and Al targets. Said R, Ahmed W, Abuain T, Abuazza A, Gracio J. J Nanosci Nanotechnol. 2010 Apr;10(4):2600-5. PMID: 20355470 [PubMed]
Closed field unbalanced magnetron sputtering ion plating of Ni/Al thin films: influence of the magnetron power. Said R, Ahmed W, Gracio J. J Nanosci Nanotechnol. 2010 Apr;10(4):2558-63. PMID: 20355462 [PubMed]
The effect of magnetron pulsing on the structure and properties of tribological Cr-Al-N coatings. Lin J, Moore JJ, Mishra B, Sproul WD, Rees JA. J Nanosci Nanotechnol. 2010 Feb;10(2):1278-85. PMID: 20352789 [PubMed]
Effect of the growth conditions on the optical and mechanical properties of TiO2 and Al2O3 films. G-Berasategui E, Bayon R, Fernandez-Diaz B, Ruiz de Gopegui U, Goikoetxea J, Zubizarreta C, Ciarsolo I, Barriga J. J Nanosci Nanotechnol. 2010 Feb;10(2):1051-6. PMID: 20352755 [PubMed]
TiO2-based nanopowders and thin films for photocatalytical applications. Radecka M, Rekas M, Kusior E, Zakrzewska K, Heel A, Michalow KA, Graule T. J Nanosci Nanotechnol. 2010 Feb;10(2):1032-42. PMID: 20352753 [PubMed]
Laser-plasma debris from a rotating cryogenic-solid-Xe target. Amano S, Inaoka Y, Hiraishi H, Miyamoto S, Mochizuki T. Rev Sci Instrum. 2010 Feb;81(2):023104. PMID: 20192482 [PubMed]
Micromachining tools and correlative approaches for cellular cryo-electron tomography. Rigort A, Bäuerlein FJ, Leis A, Gruska M, Hoffmann C, Laugks T, Böhm U, Eibauer M, Gnaegi H, Baumeister W, Plitzko JM. J Struct Biol. 2010 Nov;172(2):169-79. Epub 2010 Feb 21. PMID: 20178848 [PubMed - in process]
Processing, structure, and properties of nanostructured multifunctional tribological coatings. Lin J, Park IW, Mishra B, Pinkas M, Moore JJ, Anton JM, Kim KH, Voevodin AA, Levashov EA. J Nanosci Nanotechnol. 2009 Jul;9(7):4073-84. PMID: 19916411 [PubMed]
Structure and properties of Al-doped ZnO transparent conductive thin-films prepared by asymmetric bipolar pulsed DC reactive magnetron sputtering. Hsu FY, Chen TH, Peng KC. J Nanosci Nanotechnol. 2009 Jul;9(7):4008-15. PMID: 19916401 [PubMed]
Mechanical characterization of a functionally graded nanocomposite thin film. Piedade AP, Nunes J, Vieira MT. J Nanosci Nanotechnol. 2009 Jun;9(6):3792-7. PMID: 19504921 [PubMed]
Ti/Al nanolayered thin films. Ramos AS, Vieira MT, Serra C. J Nanosci Nanotechnol. 2009 Jun;9(6):3627-32. PMID: 19504893 [PubMed]
Coupling of morphology to surface transport in ion-beam-irradiated surfaces: normal incidence and rotating targets. Muñoz-García J, Cuerno R, Castro M. J Phys Condens Matter. 2009 Jun 3;21(22):224020. Epub 2009 May 12. PMID: 21715758 [PubMed - in process]
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Tungsten Sputtering Deposition
Uses & Applications for Tungsten Sputtering Targets
Deposition Methods that do not Require Tungsten Sputtering Targets
Tungsten Carbide Sputtering Target
Tungsten Oxide Rotatable Sputtering Target
Tungsten Oxide Sputtering Target
Tungsten Rotatable Sputtering Target
Tungsten Silicon Sputtering Target
Tungsten Sputtering Target
Tungsten Titanium Sputtering Target
Sputtering Target, Foil, Rod, Wire, Bar, Sheet, Plate and < 0.5 mm Thin Film from rare earth and other electronic and optic materials. American Elements produces high purity metals and compounds with the highest possible density and smallest possible average grain sizes for use in semiconductor, chemical deposition and physical vapor deposition (PVD) display and optical applications. We also produce the rare earths and most advanced metals as cast rods and plates.99.999% Gold Foil for chemical vapor deposition
Materials are produced using crystallization, solid state and other ultra high purification processes. American Elements specializes in producing custom compositions for research and new proprietary technologies.
Indium Sputtering Target
Sputtering Targets. Our standard target sizes range from 1" to 8" in diameter and from 2mm to 1/2" thick. We can also provide targets outside this range in addition to just about any size rectangular, annular, or oval target. Materials are produced using crystallization, solid state and other ultra high purification processes such as sublimation. American Elements specializes in producing custom compositions for commercial and research applications and for new proprietary technologies. American Elements also casts any of the rare earth metals and most other advanced materials into rod, bar or plate form, as well as other machined shapes and through other processes such as nanoparticles (See also application discussion at Nanotechnology Information and at Quantum Dots) and in the form of solutions and organometallics. Other shapes are available by request.
Rotatable Targets. For large area thin film deposition, American Elements produces rotatable sputtering targets by plasma deposition onto a tubular substrate and by casting. Rotatable sputtering targets are available up to 1,000 mm in length and can be produced from a number of metallic, oxide and alloy sources for use in many applications where large film areas are required, such as photovoltaic and other coatings.
All machined pieces are produced by casting oversized blanks, and machining down to required specifications. They are usually machined to tolerances of +0.010"/-0" on diameter, length or width, and +/-0.005" on thickness. Larger targets are also finished to a flatness within 0.015". We can accommodate tighter tolerances upon request.
SPUTTERING DEPOSITION
Sputtering deposition uses a plasma, which is usually formed from a non-reactive gas, to bombard the target material for the thin film and knock the atoms of the target material out of its bulk. The ejected atoms then land on the substrate and form a thin film. Since the target does not need to be heated, the technique is very flexible for a wide range of applications. The targets can even be made of compounds or mixtures, not just pure elements.
USES & APPLICATIONS FOR SPUTTERING TARGETS
Uses & applications for sputtering targets and other evaporation materials have continued to expand. The most recent uses are described below and in the new PBS NOVA series "Making Stuff". When relevant, properties and the latest research is also covered.
Electronics and Semiconductors. The first commercial use for the sputtering target was in semiconductors and electronics for front end and back end packaging, diffusion barriers, compounds, phase change memory, IC interconnects, micro contacts, and in sensors, MEMs and LEDs. Sputtering targets and evaporation materials of copper and copper alloys including copper-nickel, copper-chromium are manufactured for packaging and other applications, as well as, nickel and many nickel alloys including nickel-aluminum, nickel-vanadium, nickel-platinum, nickel-copper and nickel-chromium. Aluminum is available In its elemental form and alloyed with copper and silicon as aluminum-copper, aluminum-silicon and aluminum-copper-silicon. Elemental titanium is available up to 99.999% purity and alloyed in titanium-tungsten. The conductive and solder wetting properties of gold make it an important deposition material, including gold alloys such as gold-tin, gold-antimony, gold-silicon, gold-copper, and gold-germanium. Recent materials include Phase Change Alloys such as germanium-antimony alloyed with tellurium, silver, indium and platinum and transparent conductive oxides (TCO) for light emitting applications such as sensors and light emitting diodes (LED). These include indium-tin oxide (ITO) and zinc oxide doped with aluminum and other elements (ZnO). American Elements also produces ultra high purity sputtering targets and other evaporation materials for electronic applications including hafnium, molybdenum, silver, iridium, rhodium and ruthenium.
Anti-abrasive coatings for Wear Protection. Electroplating of tool, die, drilling and cutting tool active surfaces to protect against wear and extend life has given way in recent years to the deposition of these coating materials as a more cost effective alternative. Typical protective materials using sputtering targets and other evaporation materials include titanium, titanium carbide, silicon carbide, boron carbide, aluminum, nickel, chromium and tungsten carbide.
Magnetic Materials. The use of high strength magnets have found application is numerous industries including automotive, aerospace, biomedical imaging and auditory engineering. sputtering targets and other evaporation materials of these advanced magnetic materials are manufactured by American Elements from samarium cobalt and neodymium iron boron alloy.
Optical and Architectural Glass. The ability of certain elements to selectively absorb and emit highly specific wave length ranges and also reduce glare due to their high refractive index when deposited on a glass substrate resulted in the development of sputtering and evaporation materials of elemental rare earths, such as neodymium and dysprosium and many other optically active and anti-reflective (AR) materials. More recently, architectural glass for residential, commercial and office building applications has benefited from the availability of these same coatings.
Photovoltaic Solar Energy Panels. The three primary solar energy technologies, silicon based, Copper Indium Selenide (CIS) and Copper Indium Gallium Selenide (CIGS) are layered structures that require sputtering targets and other evaporation materials at several stages including certain transparent conductive oxides (TCO) such as indium tin oxide (ITO) and doped zinc oxide as the top electrode, molybdenum as the back plate, and antimony telluride and zinc telluride in CIS and CIG photovoltaic cells.
Solid Oxide Fuel Cells. Typical solid oxide fuel cell (SOFC) designs contain an electronically conductive low density cathode, a high density, ionically conductive electrolyte and an electronically conductive open air electrode. New technology is being developed for the deposition of these layers. Sputtering targets are produced by American Elements to meet the needs of each of these layers including Perovskite cathode materials including Lanthanum Strontium Manganite (LSM), Lanthanum Strontium Ferrite (LSF), Lanthanum Strontium Cobaltite Ferrite (LSCF), Lanthanum Strontium Chromite (LSC), and Lanthanum Strontium Gallate Magnesite (LSGM) with doping levels and other parameters to customer specifications and ionically conductive electrolytes including YSZ (Yttria stabilized Zirconia), SCZ (Scandium doped Zirconia), Samarium doped Ceria, Gadolinium doped Ceria and Yttrium doped Ceria. These fuel cells materials are marketed under the trademark AE Fuel Cells.
Data Storage. Sputtering targets and other evaporation materials are now essential to the coating and manufacturing of optical storage devices such as CDs and DVDs to provide both wear protection and reflectivity.
DEPOSITION METHODS THAT DO NOT REQUIRE SPUTTERING TARGETS
Pulsed laser deposition (PLD) uses pulses of a high-power laser beam to ablate the target material. The material on the target surface is instantly evaporated and turned into plasma, and it returns back to vapor phase. Finally, the ablated material then collects and deposits on top of a correctly placed substrate. This technique has the advatages over the others in that it preserves the stoichiometry of the target on the film formed and the rate of deposition is higher than the others.
Physical vapor deposition (PVD). PVD refers to the purely physical formation of the thin film on top of the substrate, there should be no chemical reactionUltra High Purity Cadmium Telluride Bouleinvolved in the formation of the thin film. Typically PVD is done in a low-pressure environment, though there are a number of PVD techniques. Evaporation deposition raises the temperature of material of thin film so its vapor pressure reaches a useful range. The vapor then moves and deposits on top of the substrate of interest. Electron Beam Evaporation a form of PVD in which the target anode is bombarded with an electron beam given off by a charged tungsten filament under high vacuum. The electrion beam causes atoms from the target material to transform into a gaseous phase, these atoms then return to solid form coating everything in the vacuum chamber with a thin film. It can also be used in conjuction with molecular beam epitaxy (MBE).
Electron beam evaporation research applications include medical, metallurgical, telecommunication, microelectronics, optical coating, nanotechnology and semiconductor industries. Typical source materials include titanium, platinum, aluminum, aluminum oxide, antimony, barium, bismuth, boron, boron carbide, calcium, cerium, chromium, chromium oxide, cobalt, dysprosium, erbium, gadolinium, hafnium, hafnium oxide, indium, indium tin oxide, iridium, iron, lead, lithium, lithium fluoride, magnesium, magnesium fluroide, magnesium oxide, manganese, molybdenum, neodymium, nickel, nickel-chromium, nickel iron, niobium, palladium, permalloy hymu 80 (Fe-Mn-Mo-Ni), rhenium, rhodium, ruthenium, samarium, scandium, selenium, silicon, silicon dioxide, silicon monoxide, strontium, tantalum, tantalum oxide, tin, tin oxide, titanium, titanium dioxide, titanium monoxide, tungsten, tungsten oxide, vanadium, ytterbium, yttrium, yttrium fluoride, zinc, zinc oxide, zinc sulfide, zirconium, zirconium oxide, copper, silver, gold, gold-tin, gold-germanium, and other metals and alloys.
Chemical vapor deposition(CVD) refers to the formation of the thin film on the substrate involves chemical reaction. Typically, a fluid precursor moves onto the substrate and one or more chemical reactions take place, which forms a layer of the thin film. Chemical Vapor Deposition generally uses a gas-phase precursor, often a halide or hydride of the element to be deposited. In the case of metal-organic chemical vapor depsoisition(MOCVD), an organometallic gas is used. Commercial techniques often use very low pressures of precursor gas. In the case of plasma-enhanced chemical vapor deposition(PECVD), which is a special case of MOCVD, an ionized vapor, or plasma, is used as a precursor. Commercial PECVD relies on electromagnetic means (electric current or microwave excitation), rather than a chemical reaction, to produce a plasma. MOCVD is currently being used in the manufacturing of graphene, carbon nanotubes, LED, laser-emitting diodes, multijunction solar cell, optoelectronics, microelectronics, semiconductor, phase-change memory, photodectors, and mirco-electro-mechanical systems(MEMS). Chemical depositon is typically much less directional, or sensitive to geometry, than physical deposition
Foils. American Elements produces rolled foils and sheets in various thicknesses and sizes. Most foils are produced from cast Ingots for use in coating and thin film Chemical Vapor Deposition (CVD) and Physical Vapor Deposition (PVD) processes including Thermal and Electron Beam (E-Beam) Evaporation, Low Temperature Organic Evaporation, Atomic Layer Deposition (ALD), Organometallic and Chemical Vapor Deposition (MOCVD) for specific applications such as fuel cells and solar energy. Scandium foils are produced from distilled scandium that does not contain tantalum. Thickness can range from 0.003" to approximately 2mm for all metals. Some metals can also be rolled down as thin as 0.001” for use as an evaporation source in microelectronics, optics, magnetics, MEMS, and hard resistant coatings. Piece sizes are available up to approximately 7" maximum width. Maximum lengths of about 20" can be obtained with a nominal thickness between about 0.005" and 0.020".
99.999% Copper Foil 99.999% Dysprosium Foil 99.999% Gold Foil
Rods and Plates. American Elements casts any of the rare earth metals and most other advanced material into rod, bar or plate form, as well as other machined shapes. All as-cast rods, bars and plates are produced from either the pure metal Ingots or sublimed metals. We have a variety of standard sized rod molds, from a minimum of 1/4" diameter up to 3" diameter for most rod needs. Plates are also offered in standard thicknesses, from 1/4" thick to 1" thick. Maximum rod lengths and maximum plate sizes are dependent on melt capacity and furnace room. Small diameter rods may have only a 4"-6" maximum cast length, whereas larger diameter rods may be cast up to about 16" long. Plate sizes can be cast up to a size of 24" x 16". As-cast rods or plates are saw-cut to length or final dimensions, and the metal surface may have visible flow marks.
Round Metallic Tubes--Selected DimensionsTubing. AE produces a complete line of fully characterized round, oval, rectangular and square seamless tubing in diameters from 0.2 to 6.0 inches and wall thicknesses from 0.003 to 0.500 inches produced from advanced and high purity metals for use in industrial and research applications in the fields of electronics, energy, medical devices and aerospace among many others. Tubing can be further processed at the customer's request to rings, washers, sleeves and sheaths. Tubing is produced from most metals including: Aluminum, Bismuth, Carbon, Cerium (as well as most other rare earths), Chromium, Cobalt, Copper, Erbium, Germanium, Gold, Indium, Iron, Magnesium, Manganese, Molybdenum, Neodymium, Nickel, Niobium, Ruthenium, Silicon, Silver, Tin, Titanium, Tungsten, Vanadium, Yttrium, Zinc, and Zirconium.
PRODUCT CATALOG
U.S. Operations
Foil Price Quote Tolling Ultra High Purity Sputtering Target Crystal Growth Advanced Materials Information Center Home
German Korean French Japanese Spanish Chinese (Simplified) Portuguese Russian Chinese (Taiwan) Italian Turkish Polish Dutch Czech Swedish Hungarian Danish Hebrew
Production Catalog Available in 36 Countries & Languages
Print this Page Twitter
Periodic table of the elements science and academic information, elements and advanced materials data, scientific presentations and all pages, designs, concepts, logos, and color schemes herein are the copyrighted proprietary rights and intellectual property of American Elements. American Elements is a U.S. Registered Trademark. © 1998-2012. American Elements. All rights reserved.
Reach Lean Sigma
Recent Research & Development for Sputtering Targets
Antireflection coatings for deep ultraviolet optics deposited by magnetron sputtering from Al targets. Liao BH, Lee CC. Opt Express. 2011 Apr 11;19(8):7507-12. doi: 10.1364/OE.19.007507. PMID: 21503058 [PubMed - in process]
Directional alignment of FeCo crystallites in Si/NiFe/Ru/FeCoB multilayer with high anisotropy field above 500 Oe. Hirata K, Gomi S, Nakagawa S. J Nanosci Nanotechnol. 2011 Mar;11(3):2739-42. PMID: 21449466 [PubMed - indexed for MEDLINE]
Structural and optical properties of Cu doped ZnO thin films by co-sputtering. Chung SM, Shin JH, Lee JM, Ryu MK, Cheong WS, Park SH, Hwang CS, Cho KI. J Nanosci Nanotechnol. 2011 Jan;11(1):782-6. PMID: 21446545 [PubMed]
Structural properties of lithium thio-germanate thin film electrolytes grown by radio frequency sputtering. Seo I, Martin SW. Inorg Chem. 2011 Mar 21;50(6):2143-50. Epub 2011 Feb 16. PMID: 21323361 [PubMed - indexed for MEDLINE]
[Spectrum diagnostics for optimization of experimental parameters in thin films deposited by magnetron sputtering]. Guo QL, Cui YL, Chen JH, Zhang JP, Huai SF, Liu BT, Chen JZ. Guang Pu Xue Yu Guang Pu Fen Xi. 2010 Dec;30(12):3179-82. Chinese. PMID: 21322200 [PubMed - in process]
Synthesis of gold nanoparticles in a biocompatible fluid from sputtering deposition onto castor oil. Wender H, de Oliveira LF, Feil AF, Lissner E, Migowski P, Meneghetti MR, Teixeira SR, Dupont J. Chem Commun (Camb). 2010 Oct 7;46(37):7019-21. Epub 2010 Aug 25. PMID: 20737077 [PubMed - indexed for MEDLINE]
Gas phase photocatalytic activity of ultrathin Pt layer coated on alpha-Fe2O3 films under visible light illumination. Zhang Z, Hossain MF, Miyazaki T, Takahashi T. Environ Sci Technol. 2010 Jun 15;44(12):4741-6. PMID: 20476786 [PubMed - indexed for MEDLINE]
Magnetron-sputtered Ag surfaces. New evidence for the nature of the ag ions intervening in bacterial inactivation. Mejía MI, Restrepo G, Marín JM, Sanjines R, Pulgarín C, Mielczarski E, Mielczarski J, Kiwi J. ACS Appl Mater Interfaces. 2010 Jan;2(1):230-5. PMID: 20356239 [PubMed - indexed for MEDLINE]
Growth and characterisation of NiAl and N-doped NiAl films deposited by closed field unbalanced magnetron sputtering ion plating using elemental ni and Al targets. Said R, Ahmed W, Abuain T, Abuazza A, Gracio J. J Nanosci Nanotechnol. 2010 Apr;10(4):2600-5. PMID: 20355470 [PubMed]
Closed field unbalanced magnetron sputtering ion plating of Ni/Al thin films: influence of the magnetron power. Said R, Ahmed W, Gracio J. J Nanosci Nanotechnol. 2010 Apr;10(4):2558-63. PMID: 20355462 [PubMed]
The effect of magnetron pulsing on the structure and properties of tribological Cr-Al-N coatings. Lin J, Moore JJ, Mishra B, Sproul WD, Rees JA. J Nanosci Nanotechnol. 2010 Feb;10(2):1278-85. PMID: 20352789 [PubMed]
Effect of the growth conditions on the optical and mechanical properties of TiO2 and Al2O3 films. G-Berasategui E, Bayon R, Fernandez-Diaz B, Ruiz de Gopegui U, Goikoetxea J, Zubizarreta C, Ciarsolo I, Barriga J. J Nanosci Nanotechnol. 2010 Feb;10(2):1051-6. PMID: 20352755 [PubMed]
TiO2-based nanopowders and thin films for photocatalytical applications. Radecka M, Rekas M, Kusior E, Zakrzewska K, Heel A, Michalow KA, Graule T. J Nanosci Nanotechnol. 2010 Feb;10(2):1032-42. PMID: 20352753 [PubMed]
Laser-plasma debris from a rotating cryogenic-solid-Xe target. Amano S, Inaoka Y, Hiraishi H, Miyamoto S, Mochizuki T. Rev Sci Instrum. 2010 Feb;81(2):023104. PMID: 20192482 [PubMed]
Micromachining tools and correlative approaches for cellular cryo-electron tomography. Rigort A, Bäuerlein FJ, Leis A, Gruska M, Hoffmann C, Laugks T, Böhm U, Eibauer M, Gnaegi H, Baumeister W, Plitzko JM. J Struct Biol. 2010 Nov;172(2):169-79. Epub 2010 Feb 21. PMID: 20178848 [PubMed - in process]
Processing, structure, and properties of nanostructured multifunctional tribological coatings. Lin J, Park IW, Mishra B, Pinkas M, Moore JJ, Anton JM, Kim KH, Voevodin AA, Levashov EA. J Nanosci Nanotechnol. 2009 Jul;9(7):4073-84. PMID: 19916411 [PubMed]
Structure and properties of Al-doped ZnO transparent conductive thin-films prepared by asymmetric bipolar pulsed DC reactive magnetron sputtering. Hsu FY, Chen TH, Peng KC. J Nanosci Nanotechnol. 2009 Jul;9(7):4008-15. PMID: 19916401 [PubMed]
Mechanical characterization of a functionally graded nanocomposite thin film. Piedade AP, Nunes J, Vieira MT. J Nanosci Nanotechnol. 2009 Jun;9(6):3792-7. PMID: 19504921 [PubMed]
Ti/Al nanolayered thin films. Ramos AS, Vieira MT, Serra C. J Nanosci Nanotechnol. 2009 Jun;9(6):3627-32. PMID: 19504893 [PubMed]
Coupling of morphology to surface transport in ion-beam-irradiated surfaces: normal incidence and rotating targets. Muñoz-García J, Cuerno R, Castro M. J Phys Condens Matter. 2009 Jun 3;21(22):224020. Epub 2009 May 12. PMID: 21715758 [PubMed - in process]
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【Chinatungsten】tungsten copper electrolytic process
Processing In the process of electrolyzation, use a certain proportion of NaCl, KCl, Na2WO4 and CuO4 mixed solution and graphite as el...
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Tungsten contact is used in the switch to connect or disconnect the circuit. Tungsten contact has a wide range of applications, covering a...
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Tungsten Carbides Powders Tungsten carbide powder applied to gate valves.Wear Resistant Thermal Spray Coatings of tungsten carbide are...
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Main Application of Tungsten Tungsten (W) is a metal with a wide range of uses, the largest of which is as tungsten carbide in cemented c...
